GOEPEL electronic, world-class vendor of Embedded System Access (ESA) solutions, announces the support of the 4th generation Intel® Core™ processors (code-named “Haswell”) within the framework of the SYSTEM CASCON™ platform for validation and test of complex processor boards.
SYSTEM CASCON™ is an integrated software development environment with a comprehensive tool suite, uniform GUI, and graphical project development for the synchronized utilization of all ESA technologies, enabling test, programming, and debug operations without nail or probe access (noninvasive). In addition to JTAG/Boundary Scan/ IEEE 1149.x, key elements of the ESA philosophy are, in particular, Processor Emulation Test, Chip Embedded Instrumentation, Core Assisted Programming, and FPGA Assisted Test.
Support of the new Intel processors is based on the recently introduced Intel® Silicon View Technology (Intel® SVT). Intel® SVT is a proprietary method, comprised of various features integrated into Intel processors and chipsets, enabling platform debugging, electrical validation and production test. Complex 4th generation Intel Core processor-based designs with reduced physical access and high-speed signals can now be tested structurally and functionally with high-quality diagnostics. By means of processor-specific VarioTAP® models, these capabilities can be seamlessly incorporated into SYSTEM CASCON. Additional information can be found at goepel.com/en/jtag-boundary-scan/silicon-partner/intel-corporation.html
“For more than a decade our system solutions have enabled the utilization of Boundary Scan/IEEE 1149.x features of Intel processors for the test of complex boards. Supporting the 4th generation Intel Core processors based on the Intel Silicon View Technology is the next logical step in the exploitation of additional validation and test opportunities with our Embedded System Access philosophy“, explains Heiko Ehrenberg, Technology Officer for Embedded System Access Technologies and Managing Director at GOEPEL electronics LLC in the US. “For designs applying the 4th generation Intel Core processors, our OEM, ODM and EMS customers can now refer to new SYSTEM CASCON tools to accelerate prototyping, shorten time frames for New Product Introduction (NPI), and ensure the quality of production test with reduced access. As quite a number of these users are also members of the Intel Intelligent System Alliance, this platform enables us to specifically address the needs of, and cooperate with, system developers, system manufacturers, and system integrators.”
In the context of the new product development, GOEPEL electronic has joined the Intel® Intelligent Systems Alliance as General Member. Intel Intelligent Systems Alliance is a global ecosystem of 200+ member companies that provide the performance, connectivity, manageability, and security developers need to create smart, connected systems. Close collaboration with Intel enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.
About the 4th Generation Intel Core CPUs and Intel® SVT
The 4th generation Intel® Core™ processor platform is based on an enhanced Tri-Gate transistor design and 22nm process technology. It provides increased performance, double graphics performance, 50% longer battery life for portable applications and an increased I/O flexibility supporting USB 3.0, PCI Express 3.0 and serial ATA interfaces. Additionally, the architecture enables Intel Silicon View Technology utilization securing design and test quality for OEM and ODM. More information on intel.com
Intel® and Intel Core™ are registered trademarks of Intel Corporation in the United States and other countries.